The instruments are controlled by large computer systems able to convert CAD drawings into exposure sequences.

The instruments shown here represent both systems designed for research in quantum electronics as well as production of high density masks and reticles.

	JBX-5000LS/E Direct write tool
	Specifications Exposure: Vector scan, spot beam Acc. Voltage: 25 and 50 kV Beam source: LaB6 Current density: 50 A/cm2max. Beam size: 8 nm to 1,000 nm Acc.Voltage: 0.5 - 30 kV Workpiece size: Max. 150 mm diam.
	JBX-6000FS/E Direct write tool
	Specifications Exposure: Vector scan, spot beam Acc. Voltage: 25 and 50 kV Beam source: ZrO/W TFEG Current density:  2,000 A/cm2 max . Beam size: 5 nm to 200 nm. Workpiece size: Max. 200 mm diam.
	JBX-9300FS Direct write tool
	Specifications Exposure: Vector scan, spot beam Acc. Voltage: 50 and 100 kV Beam source: ZrO/W TFEG Current density: 4,000 A/cm2 max . Beam size: 4 nm to 200 nm. Workpiece size: Max. 300 mm diam   Read more...
	JBX-9000MVII Mask making tool
	Specifications Acc. Voltage: 50 kV Beam source: LaB6 Workpiece size: Max. 230 mm square Field stiching + 11 nm Overlay accuracy + 20 nm
	JBX-3030MV Mask making tool
	Specifications Acc. Voltage: 50 kV Beam source: LaB6 Workpiece size: Max. 178 mm square Field stiching: + 9 nm Overlay accuracy: + 12 nm  Read more....